Technologies for printing sensors and electronics over large flexible substrates: a review

摘要

Printing sensors and electronics over flexible substrates is an area of significant interest due to low-cost fabrication and possibility of obtaining multifunctional electronics over large areas. Over the years, a number of printing technologies have been developed to pattern a wide range of electronic materials on diverse substrates. As further expansion of printed technologies is expected in future for sensors and electronics, it is opportune to review the common features, complementarities and the challenges associated with various printing technologies. This paper presents a comprehensive review of various printing technologies, commonly used substrates and electronic materials. Various solution/dry printing and contact/non-contact printing technologies have been assessed on the basis of technological, materials and process related developments in the field. Critical challenges in various printing techniques and potential research directions have been highlighted. Possibilities of merging various printing methodologies have been explored to extend the lab developed standalone systems to high-speed roll-to-roll (R2R) production lines for system level integration.